▶ 제품 설명
- ENPR는 micromachining 및 microelectronic applications을 위해 설계되고
다양한 표면과의 접착력이 강화된 high contrast, epoxy resin기반의
negative Photoresist 입니다.
◎ High aspect ratio imaging with vertical side walls
◎ Near UV (350-400nm) processing
◎ Film thicknesses from 0.5 to 200µm with single spin coat
◎ Highly chemical and temperature resistance
◎ Improved Adhesion (Si, Glass, Sapphire, Metal)